Web2.5D is a packaging methodology for including multiple die inside the same package. The approach typically has been used for applications where performance and low power are critical. Communication between chips is accomplished using either a silicon or organic interposer, typically a chip or layer with through-silicon vias for communication.
T6727S - TOSHIBA - IC Chips - Kynix
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Toyota Hilux 3.0 D4D (Euro 4) Unichip ECU Tuning Kit
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